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6

Papers

114

Citations

3

h-index

2

i10-index

Kepeng Wu is an academic researcher from Northeastern University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Aluminum Alloy Microstructure Properties & Advanced Welding Techniques Analysis. The author has an h-index of 3, co-authored 6 publications.

Research Topics

Electronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAdvanced Welding Techniques AnalysisAluminum Alloys Composites PropertiesMicrostructure and Mechanical Properties of Steels

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