3D IC and TSV technologies
1 works
J
Jun Li
Claim or correct this author profile
Claim this profile or suggest corrections to the name, affiliation, bio, photo, or paper titles. Approved changes appear as verified CitedEvidence overlays.
2
Papers
1
Citations
1
h-index
0
i10-index
Jun Li is an academic researcher. The author has contributed to research in topics: 3D IC and TSV technologies. The author has an h-index of 1, co-authored 2 publications.
Research Topics
Research topics
topicsChat about Author
Papers
Chat
Click to start Chat