Electronic Packaging and Soldering Technologies
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J.T.S. Yip
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J.T.S. Yip is an academic researcher from Infineon Technologies (Singapore). The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Additive Manufacturing and 3D Printing Technologies & Structural Analysis of Composite Materials. The author has an h-index of 1, co-authored 1 publications.
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