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4

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4

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2

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0

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HU Xiaow is an academic researcher from Aviation Industry Corporation of China (China). The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Microstructure and mechanical properties & Aluminum Alloy Microstructure Properties. The author has an h-index of 2, co-authored 4 publications.

Research Topics

Electronic Packaging and Soldering TechnologiesMicrostructure and mechanical propertiesAluminum Alloy Microstructure PropertiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis

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