Electronic Packaging and Soldering Technologies
12 works
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22
Papers
174
Citations
7
h-index
6
i10-index
Durn‐Yuan Huang is an academic researcher from Chung Hwa University of Medical Technology. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Injection Molding Process and Properties & Epoxy Resin Curing Processes. The author has an h-index of 7, co-authored 19 publications.
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