Electronic Packaging and Soldering Technologies
4 works
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4
Papers
39
Citations
2
h-index
1
i10-index
P.L. Liao is an academic researcher from National Central University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Copper Interconnects and Reliability & 3D IC and TSV technologies. The author has an h-index of 2, co-authored 4 publications.
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