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4

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45

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2

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1

i10-index

S. K. Kang is an academic researcher from IBM Research - Thomas J. Watson Research Center. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Adhesion, Friction, and Surface Interactions. The author has an h-index of 2, co-authored 4 publications.

Research Topics

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesAdhesion, Friction, and Surface InteractionsSemiconductor materials and interfacesQuasicrystal Structures and Properties

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