T.Y. Lin

T.Y. Lin

Advanced Semiconductor Engineering (Taiwan)(TW)

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Papers

195

Citations

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T.Y. Lin is an academic researcher from Advanced Semiconductor Engineering (Taiwan). The author has contributed to research in topics: 3D IC and TSV technologies & Electronic Packaging and Soldering Technologies & Copper Interconnects and Reliability. The author has an h-index of 7, co-authored 11 publications.

Research Topics

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability Additive Manufacturing and 3D Printing Technologies Semiconductor materials and devices

Research topics

topics

3D IC and TSV technologies

11 works

Electronic Packaging and Soldering Technologies

10 works

Copper Interconnects and Reliability

4 works

Additive Manufacturing and 3D Printing Technologies

2 works

Semiconductor materials and devices

1 works

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