3D IC and TSV technologies
6 works
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10
Papers
289
Citations
7
h-index
7
i10-index
Norikazu Motohashi is an academic researcher from Tokyo Institute of Technology. The author has contributed to research in topics: 3D IC and TSV technologies & Electronic Packaging and Soldering Technologies & Molecular Junctions and Nanostructures. The author has an h-index of 7, co-authored 9 publications.
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