3D IC and TSV technologies
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5
Papers
30
Citations
3
h-index
1
i10-index
Ching-Yu Ni is an academic researcher from Taiwan Design Center. The author has contributed to research in topics: 3D IC and TSV technologies & Electronic Packaging and Soldering Technologies & Semiconductor materials and devices. The author has an h-index of 3, co-authored 5 publications.
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