Kunxuan Xiao

Kunxuan Xiao

Dongzhimen Hospital Affiliated to Beijing University of Chinese Medicine(CN)

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Papers

104

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Kunxuan Xiao is an academic researcher from Dongzhimen Hospital Affiliated to Beijing University of Chinese Medicine. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Aluminum Alloys Composites Properties. The author has an h-index of 6, co-authored 10 publications.

Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Aluminum Alloys Composites Properties Advanced Welding Techniques Analysis Intermetallics and Advanced Alloy Properties

Research topics

topics

Electronic Packaging and Soldering Technologies

7 works

3D IC and TSV technologies

4 works

Aluminum Alloys Composites Properties

3 works

Advanced Welding Techniques Analysis

3 works

Intermetallics and Advanced Alloy Properties

3 works

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