Electronic Packaging and Soldering Technologies
8 works
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26
Papers
344
Citations
7
h-index
4
i10-index
Gil-Ho Hwang is an academic researcher from Agency for Science, Technology and Research. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Additive Manufacturing and 3D Printing Technologies. The author has an h-index of 7, co-authored 23 publications.
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