Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging
2025 · ACS Omega · 2 citations
https://doi.org/10.1021/acsomega.5c08402
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76
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381
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11
h-index
12
i10-index
Seung Boo Jung is an academic researcher from Sungkyunkwan University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Advanced Welding Techniques Analysis. The author has an h-index of 11, co-authored 65 publications.
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