Influence of Magnetic Field on Electromigration Behavior in Metallic Thin Interconnects under High-density Electric Current
2026 · Thin Solid Films · 0 citations
https://doi.org/10.1016/j.tsf.2026.140896
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Kazuhiko SASAGAWA is an academic researcher from Hirosaki University. The author has contributed to research in topics: Copper Interconnects and Reliability & Electronic Packaging and Soldering Technologies & Advanced Sensor and Energy Harvesting Materials. The author has an h-index of 12, co-authored 146 publications.
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