Electronic Packaging and Soldering Technologies
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24
Papers
270
Citations
8
h-index
7
i10-index
Choon Sik Kang is an academic researcher from Seoul National University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Magnesium Alloys: Properties and Applications & 3D IC and TSV technologies. The author has an h-index of 8, co-authored 21 publications.
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