R.L. Shook

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371

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R.L. Shook is an academic researcher. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Material Properties and Processing & 3D IC and TSV technologies. The author has an h-index of 12, co-authored 20 publications.

Research Topics

Electronic Packaging and Soldering Technologies Material Properties and Processing 3D IC and TSV technologies Electromagnetic Compatibility and Noise Suppression Nanomaterials and Printing Technologies

Research topics

topics

Electronic Packaging and Soldering Technologies

17 works

Material Properties and Processing

8 works

3D IC and TSV technologies

6 works

Electromagnetic Compatibility and Noise Suppression

4 works

Nanomaterials and Printing Technologies

4 works

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