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H. R. Azimi

Intel (United States)(US)

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14

Papers

353

Citations

8

h-index

7

i10-index

H. R. Azimi is an academic researcher from Intel (United States). The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Mechanical Behavior of Composites & 3D IC and TSV technologies. The author has an h-index of 8, co-authored 12 publications.

Research Topics

Electronic Packaging and Soldering TechnologiesMechanical Behavior of Composites3D IC and TSV technologiesEpoxy Resin Curing ProcessesElectromagnetic Compatibility and Noise Suppression

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