Electronic Packaging and Soldering Technologies
74 works
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87
Papers
1.4K
Citations
23
h-index
35
i10-index
Chang-Lin Yeh is an academic researcher from Taipei Municipal Women and Children's Hospital. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & High-Velocity Impact and Material Behavior. The author has an h-index of 23, co-authored 74 publications.
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