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11

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155

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3

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1

i10-index

Hongbin Cui is an academic researcher from Shanghai Institute of Technical Physics. The author has contributed to research in topics: Grouting, Rheology, and Soil Mechanics & Soil and Unsaturated Flow & Electronic Packaging and Soldering Technologies. The author has an h-index of 3, co-authored 10 publications.

Research Topics

Grouting, Rheology, and Soil MechanicsSoil and Unsaturated FlowElectronic Packaging and Soldering TechnologiesElectrodeposition and Electroless CoatingsRecycling and utilization of industrial and municipal waste in materials production

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