Electronic Packaging and Soldering Technologies
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14
Papers
498
Citations
10
h-index
10
i10-index
W.C. Leong is an academic researcher from Universiti Sains Malaysia. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Material Properties and Processing & Vibration and Dynamic Analysis. The author has an h-index of 10, co-authored 12 publications.
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