M. C. Liao

M. C. Liao

Jiangsu University of Science and Technology(CN)

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M. C. Liao is an academic researcher from Jiangsu University of Science and Technology. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Metal Forming Simulation Techniques & 3D IC and TSV technologies. The author has an h-index of 5, co-authored 9 publications.

Research Topics

Electronic Packaging and Soldering Technologies Metal Forming Simulation Techniques 3D IC and TSV technologies Advanced Surface Polishing Techniques Microstructure and mechanical properties

Research topics

topics

Electronic Packaging and Soldering Technologies

6 works

Metal Forming Simulation Techniques

4 works

3D IC and TSV technologies

4 works

Advanced Surface Polishing Techniques

2 works

Microstructure and mechanical properties

1 works

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