S. Bennemann

S. Bennemann

Fraunhofer Institute for Mechanics of Materials(DE)

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S. Bennemann is an academic researcher from Fraunhofer Institute for Mechanics of Materials. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Metallurgical and Alloy Processes & 3D IC and TSV technologies. The author has an h-index of 4, co-authored 7 publications.

Research Topics

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes 3D IC and TSV technologies Integrated Circuits and Semiconductor Failure Analysis Silicon Carbide Semiconductor Technologies

Research topics

topics

Electronic Packaging and Soldering Technologies

6 works

Metallurgical and Alloy Processes

3 works

3D IC and TSV technologies

2 works

Integrated Circuits and Semiconductor Failure Analysis

2 works

Silicon Carbide Semiconductor Technologies

1 works

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