Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets
2025 · Small Methods · 7 citations
https://doi.org/10.1002/smtd.202500831
Claim or correct this author profile
Claim this profile or suggest corrections to the name, affiliation, bio, photo, or paper titles. Approved changes appear as verified CitedEvidence overlays.
4
Papers
52
Citations
3
h-index
1
i10-index
Jenn‐Chyan Chang is an academic researcher from National Chung Hsing University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Structural Behavior of Reinforced Concrete & 3D IC and TSV technologies. The author has an h-index of 3, co-authored 4 publications.
Click to start Chat