Electronic Packaging and Soldering Technologies
2 works
Ruijin Hospital(CN)
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7
Papers
47
Citations
3
h-index
1
i10-index
Hueilan Xi is an academic researcher from Ruijin Hospital. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Copper Interconnects and Reliability. The author has an h-index of 3, co-authored 6 publications.
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