3D IC and TSV technologies
4 works
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8
Papers
46
Citations
4
h-index
2
i10-index
Jyh-Rong Lin is an academic researcher from Applied Science and Technology Research Institute. The author has contributed to research in topics: 3D IC and TSV technologies & Microwave Engineering and Waveguides & Electronic Packaging and Soldering Technologies. The author has an h-index of 4, co-authored 7 publications.
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