Electronic Packaging and Soldering Technologies
21 works
D
Dongshun Bai
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33
Papers
333
Citations
10
h-index
10
i10-index
Dongshun Bai is an academic researcher from Brewer Science (United States). The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Additive Manufacturing and 3D Printing Technologies. The author has an h-index of 10, co-authored 29 publications.
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