Electronic Packaging and Soldering Technologies
36 works
Claim or correct this author profile
Claim this profile or suggest corrections to the name, affiliation, bio, photo, or paper titles. Approved changes appear as verified CitedEvidence overlays.
40
Papers
470
Citations
12
h-index
15
i10-index
Ivy Qin is an academic researcher from Kulicke & Soffa (United States). The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Advanced Welding Techniques Analysis. The author has an h-index of 12, co-authored 34 publications.
Click to start Chat