Electronic Packaging and Soldering Technologies
3 works
Endicott College(US)
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5
Papers
15
Citations
2
h-index
1
i10-index
Irv Memis is an academic researcher from Endicott College. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Advanced Sensor and Energy Harvesting Materials & Ultrasound Imaging and Elastography. The author has an h-index of 2, co-authored 5 publications.
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