Electronic Packaging and Soldering Technologies
2 works
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2
Papers
6
Citations
1
h-index
0
i10-index
Luisa Bastos Mateus is an academic researcher from Universidade Federal de Santa Catarina. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Metal and Thin Film Mechanics & 3D IC and TSV technologies. The author has an h-index of 1, co-authored 2 publications.
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