Copper Interconnects and Reliability
16 works
Fraunhofer Institute for Ceramic Technologies and Systems(DE)
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23
Papers
174
Citations
7
h-index
5
i10-index
Matthias Kraatz is an academic researcher from Fraunhofer Institute for Ceramic Technologies and Systems. The author has contributed to research in topics: Copper Interconnects and Reliability & Electronic Packaging and Soldering Technologies & Semiconductor materials and devices. The author has an h-index of 7, co-authored 20 publications.
ORCID: 0000-0002-9534-7060Click to start Chat